Browsing Electrical & Computer Engineering by Subject "Three-dimensional integrated circuits."

Now showing items 1-1 of 1

    • Dummy TSV-Based Timing Optimization for 3D On-Chip Memory 

      Pourbakhsh, Seyed Alireza (North Dakota State University, 2016)
      Design and fabrication of three-dimensional (3D) ICs is one the newest and hottest trends in semiconductor manufacturing industry. In 3D ICs, multiple 2D silicon dies are stacked vertically, and through silicon vias (TSVs) ...