Browsing Electrical & Computer Engineering Masters Theses by Subject "Chip scale packaging."

Now showing items 1-1 of 1

    • Thermo-Mechanical Selective Laser Assisted Die Transfer 

      Miller, Ross Alan (North Dakota State University, 2011)
      Laser Induced Forward Transfer (LIFT) techniques show promise as a disruptive technology which will enable the placement of components smaller than what conventional pick-and-place techniques are capable of today. Limitations ...