Browsing Electrical & Computer Engineering Masters Theses by Subject "Three-dimensional integrated circuits."

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    • Dummy TSV-Based Timing Optimization for 3D On-Chip Memory 

      Pourbakhsh, Seyed Alireza (North Dakota State University, 2016)
      Design and fabrication of three-dimensional (3D) ICs is one the newest and hottest trends in semiconductor manufacturing industry. In 3D ICs, multiple 2D silicon dies are stacked vertically, and through silicon vias (TSVs) ...